XFP 30Pos SMD Connector KLS12-XFP-01
Please download PDF information:
Product Detail
Product Tags
Product Imagines
 |
Product Information
Features:
Capax ex 10Gbps dato velocitatum signo 15 vel 30-microinch auri laminarum.
Summus celeritate contactus consilio.
SMT design in tape reel or tray packaging.
Provectae technologiae stampae ad superficiem contactum lenis.
Materia
Insulators：Polyester Thermoplastics Fibra vitrea repleta, UL 94V-0
Contactus Copper Alloy Cum Au Plated.
Electrical：
Contactus Resistentia：△R10 milliohms Max.nam signum contactus
Insulation Resistentia：1000MΩ Min.Current Rating：0.5 Amps Max.per contactum
Mechanica
Transceiver Insertion Force：40N Max.
Transceiver Extraction Force：30N Max.
Durability：100 Cycles Min.
Temperature Range：-20°C ad +85°C
